본문 바로가기
조회 수 182 추천 수 0 댓글 0

단축키

Prev이전 문서

Next다음 문서

단축키

Prev이전 문서

Next다음 문서

삼성이 TSMC와 경쟁하기 위해 3D AI 칩 패키징인 SAINT(Samsung Advanced Interconnection Technology)를 출시합니다. 

 

SRAM 메모리 칩과 CPU를 한 평면에 패키징하는 S, 수직 적층하는 D, AP를 위한 L의 세 가지가 있습니다

 

Samsung's 2.5D H-Cube chip packaging solution

 

Samsung Electronics Co., the world’s largest memory chipmaker, plans to unveil an advanced three-dimensional (3D) chip packaging technology next year to compete with foundry leader Taiwan Semiconductor Manufacturing Company (TSMC).

The Suwon, South Korea-based chipmaker will use the technology – SAINT, or Samsung Advanced Interconnection Technology – to integrate memory and processors required of high-performance chips, including AI chips, in much smaller sizes.

Under the SAINT brand, Samsung plans to unveil three types of technologies – SAINT S, which vertically stacks SRAM memory chips and the CPU; SAINT D, which involves vertical packaging of processors such as the CPU and GPU and DRAM memory; and SAINT L, which stacks application processors (APs), people familiar with the matter said on Sunday.

Current 2.5D packaging tech, in most cases, horizontally assembles different types of chips side by side.

Some of Samsung’s new technologies, including SAINT S, have already passed validation tests. However, Samsung will launch its commercial services next year after further tests with clients, sources said.

Samsung's 2.5D H-Cube chip packaging solution
Samsung's 2.5D H-Cube chip packaging solution

Packaging, one of the final steps in semiconductor manufacturing, places chips in a protective case to prevent corrosion and provides an interface to combine and connect already-made chips.

Leading chipmakers such as TSMC, Samsung and Intel Corp. are fiercely competing for advanced packaging, which integrates different semiconductors or vertically interconnects multiple chips. Advanced packaging allows multiple devices to be merged and packaged as a single electronic device.

Packaging technology can enhance semiconductor performance without having to shrink the nanometer through ultra-fine processing, which is technologically challenging and requires more time.

According to consulting firm Yole Intelligence, the global advanced chip packaging market is forecast to grow from $44.3 billion in 2022 to $66 billion by 2027. Of $66 billion, 3D packaging is expected to account for about a quarter, or $15 billion.

TSMC, CURRENT 3D PACKAGING LEADER

The technology has been rapidly increasing in line with growth in generative AI such as ChatGPT, which requires semiconductors that can process large data quickly.

TSMC is the industry leader in chip packaging technology
TSMC is the industry leader in chip packaging technology

The industry’s current mainstream is 2.5D packaging, which places chips as close together as possible to reduce data bottlenecks.

The world’s No. 1 contract chipmaker TSMC is also the leader in the global advanced packaging market with its decade-old 2.5D packaging technology.

TSMC is spending heavily to test and upgrade its 3D inter-chip stacking tech, SoIC, for its clients, including Apple Inc. and Nvidia Corp. TSMC said in July it will invest 90 billion Taiwanese dollars ($2.9 billion) in a new domestic advanced packaging plant.

Earlier this month, Taiwan's United Microelectronics Corp. (UMC), the world’s No. 3 foundry player, launched its wafer-to-wafer (W2W) 3D IC project to provide its clients with cutting-edge solutions for efficiently integrating memory and processors using silicon stacking technology.

Samsung's 2.5D H-Cube chip packaging solution
Samsung's 2.5D H-Cube chip packaging solution

UMC said its W2W 3D IC project, in collaboration with packaging firms such as ASE, Winbond, Faraday and Cadence Design Systems, is an ambitious undertaking that seeks to leverage 3D chip integration technology to address the specific requirements of edge AI applications.

Intel uses its next-generation 3D chip packaging tech, Foveros, to make advanced chips.

SAMSUNG’S CHIP PACKAGING ROADMAP

Samsung, the world’s No. 2 foundry company, has been accelerating the development of its chip packaging technology since it unveiled its 2.5D packaging technology H-Cube in 2021.

 

https://www.kedglobal.com/korean-chipmakers/newsView/ked202311120002. 




List of Articles
번호 분류 제목 글쓴이 조회 수 날짜
공지 덕질 공통 이용규칙 및 안내 (업데이트중+ 2024-04-13) 😀컴덕824 3802 2024.04.14
공지 1000P를 모으면 다이소 상품권 1000원을 신청할 수 있습니다. file Private 4929 2024.02.14
5309 질문 램 16기가짜리 2개 사려는데 1 😀컴덕1321 23 2024.06.01
5308 질문 100w 충전기로 문제 안생길까요?? 😀컴덕1842 7 2024.06.01
5307 해외직구 합산과세 질문드립니다. 1 😀컴덕554 15 2024.06.01
5306 일반 루머)AMD가 라이젠 9000시리즈에서 TDP를 다시 내린다네? file 😀컴덕579 18 2024.06.01
5305 일반 윈도우11 크롬 쓰시는분들 속보 file 😀컴덕199 14 2024.06.01
5304 일반 마이크로소프트 엣지, 무료 VPN 제공 file 😀컴덕866 8 2024.06.01
5303 일반 AMD, 인텔 시원하게 앞질렀다! 라이젠5 5600 file 😀컴덕566 21 2024.05.20
5302 일반 PC MS, 소형언어모델 '파이-3 미니' 출시 😀컴덕102 12 2024.05.20
5301 일반 그래픽카드 가성비 비교표 5월 ( 반격의 AMD !!) 영상 file 😀컴덕433 13 2024.05.20
5300 일반 구글, 크로미움에서 서드파티 쿠키 퇴출 2025년으로 또 다시 연기 😀컴덕171 16 2024.05.20
5299 일반 일론 머스크의 AI 기업 'xAI' 8조원 규모 투자 유치 😀컴덕275 12 2024.05.20
5298 일반 PC [MSI 메인보드 사용기]x670e 토마호크 와이파이 file 😀컴덕034 17 2024.05.20
5297 일반 소울시커 Soul Seeker님의 인텔 불량 테스트 2 (14900K) / 인텔의 표리부동, 사실상 13,14세대 손절? 아 욕... file 😀컴덕035 26 2024.05.20
5296 운영체제 PC 구글, 검색시장 점유율 4월 기준 전년 동월 대비 약 2% 하락 😀컴덕024 7 2024.05.20
5295 일반 MSI.인텔 13/14세대 안정 바이오스 업데이트 file 😀컴덕579 14 2024.05.20
5294 일반 라이젠 7800X3D vs 라이젠 7600!! 이길수 있을까 7600이?ㅋㅋㅋ file 😀컴덕438 17 2024.05.20
5293 일반 HBM 메모리 성장률, 2024년 200% ... 2025년 400% 전망 😀컴덕424 13 2024.05.20
5292 운영체제 MS, 윈도우 10에서 윈도우 11 23H2 버전으로 바로 업그레이드 지원 😀컴덕172 11 2024.05.20
5291 일반 대만 지진 여파로 올 2분기 DRAM 가격 13~18%, 낸드 가격 15~20% 상승 전망 😀컴덕762 12 2024.05.20
5290 일반 구글, 연례개발자회의 '구글 I/O' 통해 '제미나이 1.5' 대규모 업데이트 발표 ... 검색... file 😀컴덕887 8 2024.05.20
목록
Board Pagination Prev 1 2 3 4 5 6 7 8 9 10 ... 266 Next
/ 266